Atomic Layer Processing (ALP): Ubi es et Quo Vadis?

Abstract Atomic Layer Processing (ALP) techniques have transformed materials engineering by enabling atomic/molecular‐level control over composition, fidelity in structure replication, and properties. Tracing its origins to pioneering molecular layering and atomic layer deposition work in the mid‐20th century, this multifaceted field has remarkably diversified to include molecular layer deposition (MLD), atomic layer etching (ALE), area‐selective deposition (ASD), and vapor‐phase infiltration (VPI) processes. ALP is making great impacts across diverse disciplines – facilitating semiconductor miniaturization through ultrathin dielectric films, improving battery materials and engineering catalysts for energy applications, creating bioactive surfaces for advanced biomaterials, and promoting sustainable membranes for environmental remediation. As ALP techniques continue evolving through integration with additive manufacturing, machine learning, and in situ diagnostics, new frontiers in materials design are emerging, driven by the growing focus on environmental considerations like renewable precursors, energy‐efficient processes, and waste minimization. This perspective article examines ALP's historical development, highlights current state‐of‐the‐art applications across selected fields, and provides insights into the anticipated future trajectory, emerging application domains, and the pivotal role of academic‐industry‐research laboratory collaborations in catalyzing ALP innovations and facilitating its widespread adoption as a transformative manufacturing platform.