Research on grinding parameter optimization based on adhesive semiconductor quartz disc

Abstract To study the influence of grinding parameters on the grinding force of semiconductor quartz disc based on the adhesive clamping method, an orthogonal experiment was designed to investigate the impact of grinding parameters on the grinding force. Based on the orthogonal test data, the influencing factors and parameter optimization of the grinding force are developed. The experimental results show that the order of influence of grinding parameters on the X -axis is feed speed > spindle speed > grinding depth, the sequence of effect on the grinding force in the Y -axis is grinding depth > feed speed > spindle speed, and the order of influence on the grinding force in Z -axis is grinding depth > spindle speed > feed speed. Therefore, using a higher spindle speed, a lower feed rate and a shallower grinding depth can play a role in reducing the grinding force. By improving the grinding parameters, the stability of quartz plate grinding based on adhesive technology is verified. It is found that adhesive is a more reliable clamping method, which ensures the processing quality of quartz plate and improves the working efficiency.