Improvement of charge trapping memory performance by modulating band alignment with oxygen plasma

Metal-oxide charge trapping memory (CTM) integration into amorphous and organic flexible devices encounters challenges due to high-temperature treatment. Our approach enhances memory performance via room-temperature oxygen plasma treatment, subtly adjusting surface band alignment without changing the original material structure and surface roughness. Infiltration of oxygen plasma induces band alignment bending, creating a barrier for charge trapping. The device with oxygen plasma treatment exhibits an impressive 19.06 V memory window and a charge trapping density of 3.58 × 1013/cm2. In comparison, the memory window of untreated device only has 5.56 V, demonstrating that oxygen plasma treatment significantly improves memory characteristics. The charge retention rate exhibits outstanding stability, potentially reaching 94% after a decade. It should be noted that careful control during plasma treatment is crucial to maintaining optimal memory effects. This facile, efficient technique, applicable to various oxide layers, offers a way for future advancements in metal-oxide CTM technology.

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Publication Details

Journal
Applied Physics Letters
Published
2024-10-21
DOI
https://doi.org/10.1063/5.0224220
Citations
2
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.42

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article

Improvement of charge trapping memory performance by modulating band alignment with oxygen plasma

Kuangkuang Li, Puhao Chai, Jun Zhu, Jiale Chen
2 citations
Applied Physics Letters
Semiconductor materials and devices
0.42
article

Improvement of charge trapping memory performance by modulating band alignment with oxygen plasma

Kuangkuang Li, Puhao Chai, Jun Zhu, Jiale Chen
article en
2 citations

Abstract

Metal-oxide charge trapping memory (CTM) integration into amorphous and organic flexible devices encounters challenges due to high-temperature treatment. Our approach enhances memory performance via room-temperature oxygen plasma treatment, subtly adjusting surface band alignment without changing the original material structure and surface roughness. Infiltration of oxygen plasma induces band alignment bending, creating a barrier for charge trapping. The device with oxygen plasma treatment exhibits an impressive 19.06 V memory window and a charge trapping density of 3.58 × 1013/cm2. In comparison, the memory window of untreated device only has 5.56 V, demonstrating that oxygen plasma treatment significantly improves memory characteristics. The charge retention rate exhibits outstanding stability, potentially reaching 94% after a decade. It should be noted that careful control during plasma treatment is crucial to maintaining optimal memory effects. This facile, efficient technique, applicable to various oxide layers, offers a way for future advancements in metal-oxide CTM technology.

Applied Physics LettersVol. 125(17)
University of Electronic Science and Technology of China (CN), National Engineering Research Center of Electromagnetic Radiation Control Materials (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 37%
Semiconductor materials and devices
0.42
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