Electroless Copper Patterning on TiO2-Functionalized Mica for Flexible Electronics

The formation of conductive copper patterns on mica holds promise for developing cost-effective flexible electronics and sensing devices, though it is challenging due to the low adhesion of mica’s atomically flat surface. Herein, we present a wet-chemical method for copper patterning on flexible mica substrates via electroless copper deposition (Cu-ELD). The process involves pre-functionalizing 50 µm thick muscovite mica with a titanium dioxide (TiO2) layer, via a sol–gel dip-coating method with a titanium acetylacetonate-based sol. Photolithography is employed to selectively activate the TiO2-coated mica substrates for Cu-ELD, utilizing in situ photodeposited silver (Ag) nanoclusters as a catalyst. Copper is subsequently plated using a formaldehyde-based Cu-ELD bath, with the duration of deposition primarily determining the thickness and electrical properties of the copper layer. Conductive Cu layers with thicknesses in the 70–130 nm range were formed within 1–2 min of deposition, exhibiting an inverse relationship between plating time and sheet resistance, which ranged from 600 to 300 mΩ/sq. The electrochemical thickening of these layers to 1 μm further reduced the sheet resistance to 27 mΩ/sq. Finally, the potential of Cu-ELD patterning on TiO2-functionalized mica for creating functional sensing devices was demonstrated by fabricating a functional resistance temperature detector (RTD) on the titania surface.