Monolithic Switched-Capacitor DC-DC Converters Using BEOL-Compatible Oxide Power Transistors and Superlattice MIM Capacitors
This work reports the first experimental demonstration of on-chip switched-capacitor (SC) dc-dc voltage converters, where two types of back-end-of-line (BEOL) compatible device components—amorphous oxide semiconductor (AOS) power transistors and high-voltage (HV) superlattice MIM capacitors—were monolithically integrated for 12–6 V conversion with an efficiency of 82.8%. To implement more efficient dual-<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> circuit design, both enhancement- and depletion-mode AOS power transistors were developed. Oxygen anneal was performed to enhance transistor reliability, achieving up to a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$6.5\times $ </tex-math></inline-formula> reduction in threshold voltage shift. For the MIM capacitors, with a dielectric stack composed of Hf0.25Zr0.75O2 superlattice laminates and Al2O3 interlayers, the projected lifetime could exceed 10 years at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$120~^{\circ }$ </tex-math></inline-formula>C and 6 V bias, ensuring long-term reliable operation of the converters. Machine learning (ML)-assisted device modeling and circuit simulation results indicated that 4-interleaved design and 3-D capacitor design could further optimize the converter with the decrease of voltage ripple by ~60% and the increase of power density to >1 W/mm2. The developed on-chip SC dc-dc converters are a competitive option for implementing efficient vertical power delivery networks (PDNs) in heterogeneous 3-D integrated circuits (ICs).
Authors
- Omkar Phadke (ORCID: https://orcid.org/0000-0001-5606-6242)
- Sharadindu Gopal Kirtania (ORCID: https://orcid.org/0000-0002-8162-9155)
- Jungyoun Kwak (ORCID: https://orcid.org/0000-0003-2697-5431)
- Suman Datta (ORCID: https://orcid.org/0000-0001-6044-5173)
- Dyutimoy Chakraborty (ORCID: https://orcid.org/0000-0003-1581-9564)
- Junmo Lee (ORCID: https://orcid.org/0000-0001-6092-6436)
- Sunbin Deng (ORCID: https://orcid.org/0000-0002-3428-3120)
- Shimeng Yu (ORCID: https://orcid.org/0000-0002-0068-3652)
- Khandker Akif Aabrar (ORCID: https://orcid.org/0000-0002-3417-2025)
- Jaewon Shin
- Chengyang Zhang (ORCID: https://orcid.org/0000-0001-6361-717X)
Institutions
- Georgia Institute of Technology (US)
Publication Details
- Journal
- IEEE Transactions on Electron Devices
- Published
- 2024-10-25
- DOI
- https://doi.org/10.1109/ted.2024.3480899
- Citations
- 4
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.83