Thermal Management of Avionic Packages

The study uses computer-aided design (CAD) software to design and fabricate printed circuit boards (PCBs). The primary goal is to conduct a thermal study with the goal to determine its suitability for use in avionic applications. A Brushless DC (BLDC) motor is connected to the PCB via 24 Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) which are connected to it by a Pulse Width Modulation Signal (PWMS). Given the potential effect of these MOSFETs' failure on the functionality of the PCB, maintaining their reliability becomes more crucial as external temperatures rise. The PCB is tested at ambient (28°C) conditions with isolated load, no load, and maximum load settings. Following that, simulated outcomes with Siemens Simcenter FlothermXT are compared with the experimental findings. An in-depth understanding of MOSFET thermal behaviour, including changes in temperature at the component and board levels, is made possible through this comparative analysis. The aim of this iterative approach is to maintain the PCB's safe operation within the set temperature limits. Keywords: Avionic Package, MOSFET, PCB, Thermal Analysis, Spring Load, Load Condition