Impact of Total Ionizing Dose on Radio Frequency Performance of 22 nm Fully Depleted Silicon-On-Insulator nMOSFETs

In this paper, the degradation mechanism of the RF performance of 22 nm fully depleted (FD) silicon-on-insulator nMOSFETs at different total ionizing dose levels has been investigated. The RF figures of merit (the cut-off frequency <i>f<sub>T</sub></i>, maximum oscillation frequency <i>f<sub>max</sub></i>) show significant degradation of approximately 14.1% and 6.8%, respectively. The variation of the small-signal parameters (output conductance (<i>g<sub>ds</sub></i>), transconductance (<i>g<sub>m</sub></i>), reflection coefficient (|Γ<sub>in</sub>|), and capacitance (<i>C<sub>gg</sub></i>)) at different TID levels has been discussed. TID-induced trapped charges in the gate oxide and buried oxide increase the vertical channel field, which leads to more complex degradation of small-signal parameters across a wide frequency range.

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Publication Details

Journal
Micromachines
Published
2024-10-24
DOI
https://doi.org/10.3390/mi15111292
Citations
2
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.42

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article

Impact of Total Ionizing Dose on Radio Frequency Performance of 22 nm Fully Depleted Silicon-On-Insulator nMOSFETs

Menghao Huang, Shulong Wang, Chang Liu, Hongxia Liu et al.
2 citations
Micromachines
Semiconductor materials and devices
0.42
article

Impact of Total Ionizing Dose on Radio Frequency Performance of 22 nm Fully Depleted Silicon-On-Insulator nMOSFETs

Menghao Huang, Shulong Wang, Chang Liu, Hongxia Liu, Shupeng Chen, Junjie Huang, Xilong Zhou, Zhanpeng Yan
article en
2 citations

Abstract

In this paper, the degradation mechanism of the RF performance of 22 nm fully depleted (FD) silicon-on-insulator nMOSFETs at different total ionizing dose levels has been investigated. The RF figures of merit (the cut-off frequency <i>f<sub>T</sub></i>, maximum oscillation frequency <i>f<sub>max</sub></i>) show significant degradation of approximately 14.1% and 6.8%, respectively. The variation of the small-signal parameters (output conductance (<i>g<sub>ds</sub></i>), transconductance (<i>g<sub>m</sub></i>), reflection coefficient (|Γ<sub>in</sub>|), and capacitance (<i>C<sub>gg</sub></i>)) at different TID levels has been discussed. TID-induced trapped charges in the gate oxide and buried oxide increase the vertical channel field, which leads to more complex degradation of small-signal parameters across a wide frequency range.

MicromachinesVol. 15(11)
Xidian University (CN), China Electronic Product Reliability and Environmental Test Institute (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 37%
Semiconductor materials and devices
0.42
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