A Compact Writing Scheme for the Reliability Challenges in 1T Multi-Level FeFET Array: Variation, Endurance, and Write Disturb

Multi-level cell (MLC) ferroelectric FETs (FeFETs) face critical reliability challenges including variation, endurance and write disturb. In this work, we proposed an innovative solution to tackle all the three challenges within a compact writing scheme. Combining error correction, endurance recovery, and self-compensated writing, the proposed scheme achieves a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\gt 6\times $ </tex-math></inline-formula> reduction in error ratio (ER), a >100 improvement in endurance, and a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\gt 7\times $ </tex-math></inline-formula> reduction in Vth shift. Reliable 2 bits/cell storage with high endurance of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$10^{{8}}$ </tex-math></inline-formula> cycles and write-disturb immunity is experimentally demonstrated in the fabricated 1T FeFET array. This writing scheme is realized within a single work flow, and can be readily implemented in the operation circuits.

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Publication Details

Journal
IEEE Electron Device Letters
Published
2024-10-24
DOI
https://doi.org/10.1109/led.2024.3485803
Citations
5
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
1.04

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article

A Compact Writing Scheme for the Reliability Challenges in 1T Multi-Level FeFET Array: Variation, Endurance, and Write Disturb

Kechao Tang, Runteng Zhu, Ru Huang, Yuejia Zhou et al.
5 citations
IEEE Electron Device Letters
Semiconductor materials and devices
1.04
article

A Compact Writing Scheme for the Reliability Challenges in 1T Multi-Level FeFET Array: Variation, Endurance, and Write Disturb

Kechao Tang, Runteng Zhu, Ru Huang, Yuejia Zhou, Yihan Zhang, Hanyong Shao, Weiqin Huang
article en
5 citations

Abstract

Multi-level cell (MLC) ferroelectric FETs (FeFETs) face critical reliability challenges including variation, endurance and write disturb. In this work, we proposed an innovative solution to tackle all the three challenges within a compact writing scheme. Combining error correction, endurance recovery, and self-compensated writing, the proposed scheme achieves a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\gt 6\times $ </tex-math></inline-formula> reduction in error ratio (ER), a >100 improvement in endurance, and a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\gt 7\times $ </tex-math></inline-formula> reduction in Vth shift. Reliable 2 bits/cell storage with high endurance of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$10^{{8}}$ </tex-math></inline-formula> cycles and write-disturb immunity is experimentally demonstrated in the fabricated 1T FeFET array. This writing scheme is realized within a single work flow, and can be readily implemented in the operation circuits.

IEEE Electron Device LettersVol. 45(12)
Hong Kong University of Science and Technology (HK), Peking University (CN)
National Natural Science Foundation of China, Higher Education Discipline Innovation Project
Quality Education
Openalex Percentile: Top 23%
Semiconductor materials and devices
1.04
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A Compact Writing Scheme for the Reliability Challenges in 1T Multi-Level FeFET Array: Variation, Endurance, and Write Disturb — Kechao Tang, Runteng Zhu, et al. · IEEE Electron Device Letters (2024) | TGRS Research Map | TGRS