Review: Copper Fine Particle/Nanoparticle-Based Sintering Joining Material

Wide-bandgap power semiconductors have garnered attention for their potential use in electronic power control. For joining materials of these power semiconductors, sintering of metal nanoparticles as the bonding material has been focused. Silver nanoparticles have been extensively researched so far as these bonding materials; however, studies have shifted the focus to copper nanoparticles from the perspectives of cost and ion migration resistance. Nevertheless, copper nanoparticles are known for their low oxidation resistance, leading to a decline in sintering performance. Therefore, research has been conducted to tailor copper nanoparticle pastes to prevent their oxidation. Additionally, various techniques during the sintering process have been considered to enhance the sinter bonding. This paper introduces the paste design attempts and examples of the sintering process by using copper nanoparticle paste bonding materials.