Statistical Degradation in BGAs for Early Fault Detection

Abstract This paper presents a method for statistical analysis of ball grid array (BGA) pin degradation in packaged devices. A novel testing system is demonstrated featuring parallel monitoring of numerous pins, fast thermal cycling, and precise degradation data generation even in moderate stresses. The resistance change data due to temperature cycling stress is compared to stress on the pin due to its location on the chip. The results are vital for localizing vulnerabilities in pins that are not location-specific in the chip. The methods introduced in this study can be expanded to analyze advanced packaging assemblies.