TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices

Abstract Presentation slides for the ISTFA 2024 Tutorial session “TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices.”

Authors

Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024tpn1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices

Cecile S. Bonifacio
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
article

TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices

Cecile S. Bonifacio
article en

Abstract

Abstract Presentation slides for the ISTFA 2024 Tutorial session “TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices.”

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84925
Openalex Percentile: Top 84%
Integrated Circuits and Semiconductor Failure Analysis
DOISourceOpenAlex
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TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices — Cecile S. Bonifacio · Proceedings - International Symposium for Testing and Failure Analysis (2024) | TGRS Research Map | TGRS