X-Ray Nanotomography Enabling Submicron Resolution Failure Analysis for Advanced Packaging

Abstract Advanced packaging of electronic components is increasing complexity of single packages containing up to hundreds of individual components in a 3-dimensional arrangement. X-ray nano-tomography enables to resolve these complex structures in 3D with sub-micron resolution for failure analysis. Here we present a study using a cutout from an embedded multi-die interconnect bridge (EMIB) scanned with a custom nano-CT system utilizing a state-of-the-art nano focus X-ray source. For comparison, a scan using a commercial electronics imaging system was performed as well. We demonstrate that micron and sub-micron sized defects can be identified enabling failure analysis on the sub-micron level.