Failure Analysis Challenges for Chip Scale Packages (2024 Update)

Abstract Presentation slides for the ISTFA 2024 Tutorial session “Failure Analysis Challenges for Chip Scale Packages (2024 Update).”

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024tps1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

Failure Analysis Challenges for Chip Scale Packages (2024 Update)

Susan X. Li
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
article

Failure Analysis Challenges for Chip Scale Packages (2024 Update)

Susan X. Li
article en

Abstract

Abstract Presentation slides for the ISTFA 2024 Tutorial session “Failure Analysis Challenges for Chip Scale Packages (2024 Update).”

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84925
Infineon Technologies (United States) (US)
Openalex Percentile: Top 84%
Integrated Circuits and Semiconductor Failure Analysis
DOISourceOpenAlex
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Failure Analysis Challenges for Chip Scale Packages (2024 Update) — Susan X. Li · Proceedings - International Symposium for Testing and Failure Analysis (2024) | TGRS Research Map | TGRS