Heterogeneous Integrated Failure Analysis Using Radio Frequency Signal Detection/Injection with Power Spectrum Analysis

Abstract The rise of 2.5D and 3D heterogeneous integrated devices presents unique challenges for failure analysis, as traditional 2D analysis techniques prove inadequate due to chip stacking, layer interconnects, die obscuration, and limited access to test points. While various non-destructive techniques—including 3D X-ray imaging, lock-in thermography, magnetic field imaging, and optical beam methods—offer partial solutions, each has specific limitations. We present a novel defect localization approach using radio frequency electromagnetic (EM) emanations, implemented in two ways: detecting EM signals emitted by the device under controlled input conditions, or measuring induced voltage responses to signals injected via a scanning antenna. The technique employs scanning magnetic or electric field antennas to generate 2D or 3D electromagnetic maps revealing current and electric continuity patterns, enabling detection of shorts (additional current paths) or opens (blocked current paths). By incorporating power spectrum analysis (PSA) at each scan point, our method—designated as EM antenna PSA (EMAPSA) or EM injection PSA (EMIPSA)—provides comprehensive defect detection capabilities for 3D heterogeneous integration failure analysis.