EOS Failure in Low-Voltage Core Circuits during Latch-up Test at I/O Pins

Abstract The occurrence of electrical overstress (EOS) failure in low-voltage core circuits resulting from latch-up test at the I/O pins was investigated, where a specific commercial IC product equipped with on-chip low-dropout regulator (LDO). Through failure analysis experiments, the root cause of EOS failures is identified to the abnormal LDO output voltage during latch-up test. In this work, a modified design featuring a deep n-well (DNW) beneath the NMOS region is proposed to mitigate EOS issue by enhancing electron absorption. Additionally, compensation network configurations are explored to explain the abnormal LDO operation. The experimental results from test chip have validated the effectiveness of the proposed modifications, emphasizing the importance of proactive measures in mitigating EOS failures.

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024p0042
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

EOS Failure in Low-Voltage Core Circuits during Latch-up Test at I/O Pins

Chih‐Ping Chen, Ming‐Dou Ker, Chen-Wei Hsu, Chin-Tung Cheng et al.
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
article

EOS Failure in Low-Voltage Core Circuits during Latch-up Test at I/O Pins

Chih‐Ping Chen, Ming‐Dou Ker, Chen-Wei Hsu, Chin-Tung Cheng, Ping-Lin Chung
article en

Abstract

Abstract The occurrence of electrical overstress (EOS) failure in low-voltage core circuits resulting from latch-up test at the I/O pins was investigated, where a specific commercial IC product equipped with on-chip low-dropout regulator (LDO). Through failure analysis experiments, the root cause of EOS failures is identified to the abnormal LDO output voltage during latch-up test. In this work, a modified design featuring a deep n-well (DNW) beneath the NMOS region is proposed to mitigate EOS issue by enhancing electron absorption. Additionally, compensation network configurations are explored to explain the abnormal LDO operation. The experimental results from test chip have validated the effectiveness of the proposed modifications, emphasizing the importance of proactive measures in mitigating EOS failures.

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84918
National Yang Ming Chiao Tung University (TW), Sitronix Technology (Taiwan) (TW)
Openalex Percentile: Top 84%
Integrated Circuits and Semiconductor Failure Analysis
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