RF-LIT Use Case Studies

Abstract This paper discusses the application of the RF-LIT technique to a variety of use cases. The technique itself was introduced during last year’s ISTFA 2023 conference. The present work aims to showcase its suitability for the analysis of polyline cracks and packaging related fails such as via opens in RDL as well as cracks in solder joints. Further, a model is constructed explaining why RF-LIT can work and where the frequency dependence comes from.