Fatigue Analysis on a Newly Designed Hip Implant with Finite Element Method

This study used Finite Element Analysis (FEA) and Reverse Engineering (RE) methods to assess the fatigue performance of an originally designed cementless hip implant. The implant prototype was initially scanned using 3D scanning technology, and a finite element model was created. The implant was analyzed under dynamic loads for six different biomaterials commonly used, namely Ti-6Al-4V (Grade5), ASTM F3046 (Ti-3Al-2.5V), ASTM F75 (CoCr), ASTM F562(MP35N), ASTM F136(Ti6Al4V ELI), ASTM F67 (Ti Grade 4), and the fatigue life was evaluated. The results showed that the ASTM F75 (CoCr) implant had the highest stress and the ASTM F67 (Ti Grade 4) implant had the lowest stress. Also, Ti6Al4V (Grade 5) implant is more resistant to fatigue than their counterparts made from ASTM F75 (CoCr), ASTM F136 (Ti6Al4V ELI) and ASTM 3046 (Ti-3Al-2.5V).