Fundamentals and Emerging Capabilities: 3D X-Ray Imaging for Semiconductor Advanced Package Failure Analysis
Abstract Presentation slides for the ISTFA 2024 Tutorial session “Fundamentals and Emerging Capabilities: 3D X-Ray Imaging for Semiconductor Advanced Package Failure Analysis.”
Authors
- Cheryl Hartfield (ORCID: https://orcid.org/0000-0002-2410-423X)
Institutions
- Carl Zeiss (United States) (US)
Publication Details
- Journal
- Proceedings - International Symposium for Testing and Failure Analysis
- Published
- 2024-10-23
- DOI
- https://doi.org/10.31399/asm.cp.istfa2024tpt1
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00