E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes
Abstract This paper demonstrates that e-beam assisted device alteration (EADA) is a powerful, high-resolution technique for fault isolation debug for advanced technology nodes. A case study using this technique is reviewed and shows successful isolation of a defective single inverter. In addition, fundamental studies of ring oscillator behavior and device perturbations with e-beam exposure found clear correlations for electron beam exposure with NMOS/PMOS device parameters. Electron-hole pair generation in the device with beam exposure is likely the main component for the perturbation, but there may be other contributing factors including charging effects and/or heating.
Authors
- A. L. Matte
- Renliang Yuan (ORCID: https://orcid.org/0000-0002-7565-2885)
- Jacob Waelder (ORCID: https://orcid.org/0000-0002-1986-9457)
- Ben Niu (ORCID: https://orcid.org/0000-0001-5822-8743)
- James Vickers
- Jennifer Huening
- Neel Leslie
- Mitchell J. Senger (ORCID: https://orcid.org/0000-0002-5040-3401)
- May Ling Oh
- Zhiyong Ma
- Yunfei Wang (ORCID: https://orcid.org/0009-0000-6960-3908)
- Hyuk Ju Ryu
- Shuai Zhao
- P. Joshi
- X. Tong (ORCID: https://orcid.org/0009-0008-4123-1709)
Institutions
- Intel (United States) (US)
- Thermo Fisher Scientific (United States) (US)
Publication Details
- Journal
- Proceedings - International Symposium for Testing and Failure Analysis
- Published
- 2024-10-23
- DOI
- https://doi.org/10.31399/asm.cp.istfa2024p0519
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00