E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes

Abstract This paper demonstrates that e-beam assisted device alteration (EADA) is a powerful, high-resolution technique for fault isolation debug for advanced technology nodes. A case study using this technique is reviewed and shows successful isolation of a defective single inverter. In addition, fundamental studies of ring oscillator behavior and device perturbations with e-beam exposure found clear correlations for electron beam exposure with NMOS/PMOS device parameters. Electron-hole pair generation in the device with beam exposure is likely the main component for the perturbation, but there may be other contributing factors including charging effects and/or heating.

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024p0519
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes

A. L. Matte, Renliang Yuan, Jacob Waelder, Ben Niu et al.
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
article

E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes

A. L. Matte, Renliang Yuan, Jacob Waelder, Ben Niu, James Vickers, Jennifer Huening, Neel Leslie, Mitchell J. Senger, May Ling Oh, Zhiyong Ma, Yunfei Wang, Hyuk Ju Ryu, Shuai Zhao, P. Joshi, X. Tong
article en

Abstract

Abstract This paper demonstrates that e-beam assisted device alteration (EADA) is a powerful, high-resolution technique for fault isolation debug for advanced technology nodes. A case study using this technique is reviewed and shows successful isolation of a defective single inverter. In addition, fundamental studies of ring oscillator behavior and device perturbations with e-beam exposure found clear correlations for electron beam exposure with NMOS/PMOS device parameters. Electron-hole pair generation in the device with beam exposure is likely the main component for the perturbation, but there may be other contributing factors including charging effects and/or heating.

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84918
Intel (United States) (US), Thermo Fisher Scientific (United States) (US)
Openalex Percentile: Top 84%
Integrated Circuits and Semiconductor Failure Analysis
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E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes — A. L. Matte, Renliang Yuan, et al. · Proceedings - International Symposium for Testing and Failure Analysis (2024) | TGRS Research Map | TGRS