Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs

Abstract The effects of sample prep with a Ga+-ion Focused Ion Beam (Ga-FIB) on measurements of electron beam induced current (EBIC) were studied. Concerns have been occasionally raised about amorphization from the beam, or even Ga+ implantation ruining the ability to make useful measurements for purposes of either failure analysis or device tailoring. To understand the magnitude of any deleterious effects, two different lamellae from a 5 nm SRAM sample were prepared with different areas of increasingly improved polish, as indicated by decreasing, cumulative, FIB beam energy, followed by EBIC measurements at 1 or 2 kV beam landing energy. A first experiment looked at the ability to generate EBIC measurements from depletion zones and found no difference across the various beam polish cells. A second experiment considered leakage and/or shorts and found little problematic currents, within standard deviations.

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024p0478
Citations
1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
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article
Field-Weighted Citation Impact
0.21
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article

Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs

Gregory M. Johnson, Lorenz Lechner, Andreas Rummel, Cheryl Hartfield et al.
1 citations
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
0.21
article

Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs

Gregory M. Johnson, Lorenz Lechner, Andreas Rummel, Cheryl Hartfield, Heiko Stegmann
article en
1 citations

Abstract

Abstract The effects of sample prep with a Ga+-ion Focused Ion Beam (Ga-FIB) on measurements of electron beam induced current (EBIC) were studied. Concerns have been occasionally raised about amorphization from the beam, or even Ga+ implantation ruining the ability to make useful measurements for purposes of either failure analysis or device tailoring. To understand the magnitude of any deleterious effects, two different lamellae from a 5 nm SRAM sample were prepared with different areas of increasingly improved polish, as indicated by decreasing, cumulative, FIB beam energy, followed by EBIC measurements at 1 or 2 kV beam landing energy. A first experiment looked at the ability to generate EBIC measurements from depletion zones and found no difference across the various beam polish cells. A second experiment considered leakage and/or shorts and found little problematic currents, within standard deviations.

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84918
Carl Zeiss (Germany) (DE), Carl Zeiss (United States) (US), Klein Buendel (United States) (US)
Openalex Percentile: Top 47%
Integrated Circuits and Semiconductor Failure Analysis
0.21
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Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs — Gregory M. Johnson, Lorenz Lechner, et al. · Proceedings - International Symposium for Testing and Failure Analysis (2024) | TGRS Research Map | TGRS