Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs
Abstract The effects of sample prep with a Ga+-ion Focused Ion Beam (Ga-FIB) on measurements of electron beam induced current (EBIC) were studied. Concerns have been occasionally raised about amorphization from the beam, or even Ga+ implantation ruining the ability to make useful measurements for purposes of either failure analysis or device tailoring. To understand the magnitude of any deleterious effects, two different lamellae from a 5 nm SRAM sample were prepared with different areas of increasingly improved polish, as indicated by decreasing, cumulative, FIB beam energy, followed by EBIC measurements at 1 or 2 kV beam landing energy. A first experiment looked at the ability to generate EBIC measurements from depletion zones and found no difference across the various beam polish cells. A second experiment considered leakage and/or shorts and found little problematic currents, within standard deviations.
Authors
- Gregory M. Johnson
- Lorenz Lechner
- Andreas Rummel (ORCID: https://orcid.org/0000-0002-0645-1641)
- Cheryl Hartfield (ORCID: https://orcid.org/0000-0002-2410-423X)
- Heiko Stegmann (ORCID: https://orcid.org/0000-0001-7147-0059)
Institutions
- Carl Zeiss (Germany) (DE)
- Carl Zeiss (United States) (US)
- Klein Buendel (United States) (US)
Publication Details
- Journal
- Proceedings - International Symposium for Testing and Failure Analysis
- Published
- 2024-10-23
- DOI
- https://doi.org/10.31399/asm.cp.istfa2024p0478
- Citations
- 1
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.21