Flip Chip and Backside Techniques (2024 Update)

Abstract Presentation slides for the ISTFA 2024 Tutorial session “Flip Chip and Backside Techniques (2024 Update).”

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024tpr1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
Field-Weighted Citation Impact
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article

Flip Chip and Backside Techniques (2024 Update)

Kira L. Fishgrab, Karoline Bernhard-Höfer, Daniel L. Barton, Edward I. Cole
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
article

Flip Chip and Backside Techniques (2024 Update)

Kira L. Fishgrab, Karoline Bernhard-Höfer, Daniel L. Barton, Edward I. Cole
article en

Abstract

Abstract Presentation slides for the ISTFA 2024 Tutorial session “Flip Chip and Backside Techniques (2024 Update).”

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84925
Infineon Technologies (Germany) (DE), Sandia National Laboratories (US)
Openalex Percentile: Top 84%
Integrated Circuits and Semiconductor Failure Analysis
DOISourceOpenAlex
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Flip Chip and Backside Techniques (2024 Update) — Kira L. Fishgrab, Karoline Bernhard-Höfer, et al. · Proceedings - International Symposium for Testing and Failure Analysis (2024) | TGRS Research Map | TGRS