Defect Localization Methods for Device Characterization and Yield Management

Abstract Presentation slides for the ISTFA 2024 Tutorial session “Defect Localization Methods for Device Characterization and Yield Management.”

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Publication Details

Journal
Proceedings - International Symposium for Testing and Failure Analysis
Published
2024-10-23
DOI
https://doi.org/10.31399/asm.cp.istfa2024tpj1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

Defect Localization Methods for Device Characterization and Yield Management

Greg M. Johnson
Proceedings - International Symposium for Testing and Failure Analysis
Integrated Circuits and Semiconductor Failure Analysis
article

Defect Localization Methods for Device Characterization and Yield Management

Greg M. Johnson
article en

Abstract

Abstract Presentation slides for the ISTFA 2024 Tutorial session “Defect Localization Methods for Device Characterization and Yield Management.”

Proceedings - International Symposium for Testing and Failure AnalysisVol. 84925
Carl Zeiss (United States) (US)
Openalex Percentile: Top 84%
Integrated Circuits and Semiconductor Failure Analysis
DOISourceOpenAlex
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