Verification of Simulation of the Temperature Influence on the Characteristics of Microstrip Line with Two Side Grounded Conductors

The article presents the verification of simulation of the influence of temperature <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\boldsymbol(T)}$</tex> on the characteristics of a microstrip line (MSL) with two side grounded conductors. The verification was performed using two programs: MATLAB and TALGAT. To investigate the influence of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\boldsymbol(T)}$</tex>, we used a simple temperature model based on the thermal coefficient that determines the linear thermal changes of the materials of printed circuit boards (PCBs) of radioelectronic equipment (REE). As a base material, we chose FR-4 since it is widely used as a substrate for PCBs in REE, being cost-effective and reliable (having a high glass transition temperature <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\boldsymbol(Tg)}$</tex>. As a conductor material, we chose ordinary copper. The influence of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\boldsymbol(T)}$</tex> (-50, 25, 150 °C) was verified using a variation of parameters affecting the sensitivity (stability) of the MSL characteristics, namely the per-unit-length delay <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\tau)$</tex> and the characteristic impedance <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\boldsymbol(Z)}$</tex>. Consistency of results was obtained for both characteristics at all values of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">${\boldsymbol(T)}$</tex> with a maximum deviation of about 2%. In conclusion, to ensure the accuracy of our simulation results, additional verification was performed using the ADS program.