Integration of GAA Monolayer MoS<sub>2</sub> Nanosheet FETs with Gate First Process for Future 2D CFET Scaling

CFETs based on 2D materials hold the potential to replace Si as a channel at advanced technology nodes. In this work, gate-all-around (GAA) nanosheet FETs with the monolayer MoS $\mathbf{M}_{2}$ channels are presented. The MoS $\mathbf{M o n o l a y e r}_{2}$ was successfully suspended above the oxide trench of varying lengths. Less than $\mathbf{2 0 \%}$ sag was observed up to a trench length of 200 nm. For the first time, a gate-first process, in combination with critical point drying, is introduced to scale down GAA nanosheet FETs to 50 nm channel width and length without introducing damage to the monolayer MoS ${ }_{2}$. Perfect conformal gate stack deposition on the monolayer MoS<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> sheets is achieved by using TMA ‘soaking’ treatment. The successful demonstration of monolayer GAA 2D nanosheet FET further shows high potential as a basic component for the future 2D CFET chips integration.

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Published
2024-09-09
DOI
https://doi.org/10.1109/esserc62670.2024.10719449
Citations
5
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
Type
article
Field-Weighted Citation Impact
1.04

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Integration of GAA Monolayer MoS2 Nanosheet FETs with Gate First Process for Future 2D CFET Scaling

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article

Integration of GAA Monolayer MoS2 Nanosheet FETs with Gate First Process for Future 2D CFET Scaling

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article en
5 citations

Abstract

CFETs based on 2D materials hold the potential to replace Si as a channel at advanced technology nodes. In this work, gate-all-around (GAA) nanosheet FETs with the monolayer MoS $\mathbf{M}_{2}$ channels are presented. The MoS $\mathbf{M o n o l a y e r}_{2}$ was successfully suspended above the oxide trench of varying lengths. Less than $\mathbf{2 0 \%}$ sag was observed up to a trench length of 200 nm. For the first time, a gate-first process, in combination with critical point drying, is introduced to scale down GAA nanosheet FETs to 50 nm channel width and length without introducing damage to the monolayer MoS ${ }_{2}$. Perfect conformal gate stack deposition on the monolayer MoS<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> sheets is achieved by using TMA ‘soaking’ treatment. The successful demonstration of monolayer GAA 2D nanosheet FET further shows high potential as a basic component for the future 2D CFET chips integration.

IMEC (BE)
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Advancements in Semiconductor Devices and Circuit Design
1.04
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