Device Modeling and Optimization of MEMS Based Capacitive Pressure Sensor

Capacitive pressure sensors are widely used in various applications due to their advantages over other types of sensors, such as low power consumption, high resistance to temperature changes, and improved stability. This paper presents a performance analysis of a capacitive pressure sensor operating on the electro-mechanical interface. The analysis includes diaphragm deflection, sensitivity, linearity, capacitance versus pressure, and thermal considerations. Simulation results illustrate diaphragm displacement and capacitance under uniform external pressure (25kPa) and compare them with linearized analytical capacitance values. Additionally, the impact of packaging stress on the MEMS design process is discussed, along with a sensitivity comparison of capacitive pressure sensors with and without packaging stress.