Examine The Effectiveness Of Transmission Laser Welding In Bonding Copper To Glass Joints

This study conducted a glass-to-copper $\left(\mathbf{C u} / \mathbf{S i O}_{2}\right)$ bonding experiment using a nanosecond (ns) pulsed laser. The welding performance is optimized corresponding to the appropriate scanning speed and focal plane position. The joint shear strength could be obtained at approximately 40 MPa. Mechanisms of element intermixing and intra-diffusion are demonstrated during the welding process. The formation of several possible compounds $\mathrm{Si}-\mathrm{O}-\mathrm{Cu}$, and $\mathrm{Si}-\mathrm{Cu}$ at the interfacial region have an additional factor role in improving the bonding quality of copper/glass joints.