Investigating the impact of nano copper on the electrical conductivity of aluminum: a comprehensive study utilizing genetic algorithms methods

Nanotechnology has emerged as a transformative field in material science, offering unprecedented opportunities to enhance the electrical properties of conventional materials through the incorporation of nano-sized particles. In this extensive study, we explore the effects of varying weight percentages (1%, 2%, and 3%) and lengths (30 nm, 60 nm, 150 nm, and 250 nm) of nano copper on the electrical conductivity of aluminum (Al) across different temperatures (20°C, 50°C, 80°C, and 100°C). Additionally, GA method and Numerical correction factor and constitutive equation using Zener –Holloman parameter were employed for modeling the rheological behavior of Al based on these parameters.

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Publication Details

Journal
World Journal of Advanced Engineering Technology and Sciences
Published
2024-10-20
DOI
https://doi.org/10.30574/wjaets.2024.13.1.0390
Primary Topic
Anodic Oxide Films and Nanostructures
Type
article
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article

Investigating the impact of nano copper on the electrical conductivity of aluminum: a comprehensive study utilizing genetic algorithms methods

Ali Bahadori manizani, Leila Shafieian
World Journal of Advanced Engineering Technology and Sciences
Anodic Oxide Films and Nanostructures
article

Investigating the impact of nano copper on the electrical conductivity of aluminum: a comprehensive study utilizing genetic algorithms methods

Ali Bahadori manizani, Leila Shafieian
article en

Abstract

Nanotechnology has emerged as a transformative field in material science, offering unprecedented opportunities to enhance the electrical properties of conventional materials through the incorporation of nano-sized particles. In this extensive study, we explore the effects of varying weight percentages (1%, 2%, and 3%) and lengths (30 nm, 60 nm, 150 nm, and 250 nm) of nano copper on the electrical conductivity of aluminum (Al) across different temperatures (20°C, 50°C, 80°C, and 100°C). Additionally, GA method and Numerical correction factor and constitutive equation using Zener –Holloman parameter were employed for modeling the rheological behavior of Al based on these parameters.

World Journal of Advanced Engineering Technology and SciencesVol. 13(1)
Silicon Valley University (US)
Openalex Percentile: Top 89%
Anodic Oxide Films and Nanostructures
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