Hardware-Software Complex for Measuring the Thermal Resistance of Power Modules

The article shows the results of studies of the thermoelectric properties of power modules based on IGBT transistors are presented. It is shown that the properties of such modules can be described using a thermal impedance matrix that takes into account thermal connections between the transistors of the module. Measuring off-diagonal matrix elements using standard methods is problematic due to low accuracy. To solve the problem, it is proposed to use a modulation method for measuring thermal resistance, in which the module transistors are heated by variable thermal power. The method is implemented in a hardware and software complex designed to measure the thermal resistance of power modules with any type of transistors.