Reasons for Defects in Solder Paste Reflow in a Vapor Phase Soldering System
In this article defects occurring at reflow of solder paste Sn62Pb36Ag2 in the system of vapor-phase furnace and methods of their elimination are considered. Special attention is paid to the temperature profile and methods of its adjustment. The principle of operation of the vapor phase furnace system and technological operations that are performed during the assembly of products are given.
Authors
- I.B. Stavitsky
- S. I. Averin (ORCID: https://orcid.org/0000-0002-9271-3790)
- Oleg S. Kudryavtsev (ORCID: https://orcid.org/0000-0002-4929-747X)
- Yury Tikhonov
- Alexander Petushkov
- Mikhail Ternovsky
Institutions
- Saratov Research Center (RU)
Publication Details
- Published
- 2024-09-26
- DOI
- https://doi.org/10.1109/apede59883.2024.10715946
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00