SiC JFET Template Model for Extremely High-Temperatures

The paper proposes a compact model of a silicon-carbide (SiC) field-effect transistor with control p-n junction (JFET) whose parameters are determined by measurements. The model is developed using the template modeling method, in which constant parameters of the model are replaced by fractional-rational functions (Padé approximation), allowing to describe more accurately the physical processes in the electronic component without violating the nature of their change. The demonstrated SiC JFET model is formulated as a function of both the fundamental process parameters that control the electrical behavior of the device (e.g., threshold voltage) and the geometric layout parameters associated with the device (e.g., device length and width), providing a rational basis for statistical modeling of process variation effects.

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Published
2024-09-26
DOI
https://doi.org/10.1109/apede59883.2024.10715910
Citations
1
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.21

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article

SiC JFET Template Model for Extremely High-Temperatures

Vadim N. Biryukov, Dmitriy V. Kleimenkin, Anna V. Bugakova, Alexandr M. Pilipenko
1 citations
Silicon Carbide Semiconductor Technologies
0.21
article

SiC JFET Template Model for Extremely High-Temperatures

Vadim N. Biryukov, Dmitriy V. Kleimenkin, Anna V. Bugakova, Alexandr M. Pilipenko
article en
1 citations

Abstract

The paper proposes a compact model of a silicon-carbide (SiC) field-effect transistor with control p-n junction (JFET) whose parameters are determined by measurements. The model is developed using the template modeling method, in which constant parameters of the model are replaced by fractional-rational functions (Padé approximation), allowing to describe more accurately the physical processes in the electronic component without violating the nature of their change. The demonstrated SiC JFET model is formulated as a function of both the fundamental process parameters that control the electrical behavior of the device (e.g., threshold voltage) and the geometric layout parameters associated with the device (e.g., device length and width), providing a rational basis for statistical modeling of process variation effects.

Vol. 8
Southern Federal University (RU), Don State Technical University (RU)
Russian Science Foundation
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Openalex Percentile: Top 47%
Silicon Carbide Semiconductor Technologies
0.21
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