Kinetically Stabilized Hafnia Ferroelectric of Al-Doped HfO₂ Film by Fast Ramping and Fast Cooling Process

Hafnia-based ferroelectrics (FEs) can be stabilized via careful engineering, both kinetically and thermodynamically. Especially, the fast cooling process has been regarded as an efficient approach for kinetically maximizing the phase transition to the orthorhombic (o-) phase from the tetragonal (t-) phase, which stabilizes thermodynamically during crystallization annealing. However, accurately controlling the cooling period for fast cooling procedures is challenging, resulting in unreliable and nonreproducible outcomes and interpretation. Thus, until now, comprehending its effects has mainly relied on modeling efforts in the field of material science. Here, for the first time, we experimentally validate the fast-cooling effect with Al:HfO2 FEs, based on the novel equipment ensuring both reliability and reproducibility. In addition, it enabled us to investigate the impact of the fast cooling process on the phase, domain size, and interface quality of FEs through various electrical analyses. The fast cooling technique facilitates the transition from the t-phase to the desired o-phase, inducing significantly higher remanent polarization values of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2{P}_{r}$ </tex-math></inline-formula> (35.31 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>C/cm2) and improved subloop characteristics. In contrast, slow cooling (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2{P}_{r}$ </tex-math></inline-formula> of 9.50 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>C/cm2) leads to poor subloop properties. Given that a fast cooling procedure is useful for stabilizing the FE o-phase in thin films, we believe that our reliable annealing procedure and significant experimental findings can provide a foundation for future studies in hafnia FE material and memory devices.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2024-10-18
DOI
https://doi.org/10.1109/ted.2024.3475308
Citations
3
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
Field-Weighted Citation Impact
0.63

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article

Kinetically Stabilized Hafnia Ferroelectric of Al-Doped HfO₂ Film by Fast Ramping and Fast Cooling Process

Sangho Lee, Giuk Kim, Sanghun Jeon, Hunbeom Shin et al.
3 citations
IEEE Transactions on Electron Devices
Ferroelectric and Negative Capacitance Devices
0.63
article

Kinetically Stabilized Hafnia Ferroelectric of Al-Doped HfO₂ Film by Fast Ramping and Fast Cooling Process

Sangho Lee, Giuk Kim, Sanghun Jeon, Hunbeom Shin, Sang‐Hee Ko Park, Kang Kim, Lingwei Zhang, Junho Ahn, Young-Jin Lim, Il‐Kwon Oh
article en
3 citations

Abstract

Hafnia-based ferroelectrics (FEs) can be stabilized via careful engineering, both kinetically and thermodynamically. Especially, the fast cooling process has been regarded as an efficient approach for kinetically maximizing the phase transition to the orthorhombic (o-) phase from the tetragonal (t-) phase, which stabilizes thermodynamically during crystallization annealing. However, accurately controlling the cooling period for fast cooling procedures is challenging, resulting in unreliable and nonreproducible outcomes and interpretation. Thus, until now, comprehending its effects has mainly relied on modeling efforts in the field of material science. Here, for the first time, we experimentally validate the fast-cooling effect with Al:HfO2 FEs, based on the novel equipment ensuring both reliability and reproducibility. In addition, it enabled us to investigate the impact of the fast cooling process on the phase, domain size, and interface quality of FEs through various electrical analyses. The fast cooling technique facilitates the transition from the t-phase to the desired o-phase, inducing significantly higher remanent polarization values of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2{P}_{r}$ </tex-math></inline-formula> (35.31 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>C/cm2) and improved subloop characteristics. In contrast, slow cooling (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2{P}_{r}$ </tex-math></inline-formula> of 9.50 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>C/cm2) leads to poor subloop properties. Given that a fast cooling procedure is useful for stabilizing the FE o-phase in thin films, we believe that our reliable annealing procedure and significant experimental findings can provide a foundation for future studies in hafnia FE material and memory devices.

IEEE Transactions on Electron DevicesVol. 71(12)
Korea Advanced Institute of Science and Technology (KR), Hanyang University (KR), Ajou University (KR)
Ministry of Trade, Industry and Energy
Openalex Percentile: Top 31%
Ferroelectric and Negative Capacitance Devices
0.63
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