Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition

Authors

Y Avenas
Rémi Daudin (ORCID: https://orcid.org/0000-0001-8922-2555)
Jean‐Yves Hihn (ORCID: https://orcid.org/0000-0002-7857-2098)
Jonathan Schoenleber
Rabih Khazaka (ORCID: https://orcid.org/0000-0001-7555-0152)
Goulven Janod
Jean‐Michel Missiaen
Lucas Chachay
D. Bouvard
Marie-Pierre Gigandet

Institutions

Science et Ingénierie des Matériaux et Procédés (FR)
Institut UTINAM (FR)
Safran (France) (FR)
Laboratoire de Génie Électrique de Grenoble (FR)

Publication Details

Journal: SPIRE - Sciences Po Institutional REpository
Published: 2024-09-23
Primary Topic: Electronic Packaging and Soldering Technologies
Type: article
Field-Weighted Citation Impact: 0.00

Funders

Agence Nationale de la Recherche

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article

Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition

Y Avenas, Rémi Daudin, Jean‐Yves Hihn, Jonathan Schoenleber et al.

Sep 23, 2024

SPIRE - Sciences Po Institutional REpository

Electronic Packaging and Soldering Technologies

article

Evaluation and thermal ageing of power semiconductor die attachment based on porous film electrodeposition

Y Avenas, Rémi Daudin, Jean‐Yves Hihn, Jonathan Schoenleber, Rabih Khazaka, Goulven Janod, Jean‐Michel Missiaen, Lucas Chachay, D. Bouvard, Marie-Pierre Gigandet

September 23, 2024article en

Abstract

No abstract available for this paper.

SPIRE - Sciences Po Institutional REpository

Science et Ingénierie des Matériaux et Procédés (FR), Institut UTINAM (FR), Safran (France) (FR), Laboratoire de Génie Électrique de Grenoble (FR)

Agence Nationale de la Recherche

Openalex Percentile: Top 84%

Electronic Packaging and Soldering Technologies

Open Access PDF OpenAlex

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