Technical vision system for installation of semiconductor crystals with direct recording of the moment of installation

The article discusses the technical vision system of a machine for mounting semiconductor crystals. The disadvantage of existing systems is that the moment of installation of a semiconductor crystal on the substrate is not recorded by a camera and is in no way controlled by the operator. This makes it impossible to manually control such installations and complicates the learning process. <br/> <br/> The authors of the article eliminated this drawback by using two non-orthogonally located cameras, the focuses of which coincide with the location of the crystal on the working tool. The resulting two images are then processed. The contours of the reference marks on the substrate, already installed elements and the mounted crystal are highlighted. After geometric transformations of the selected contours, the operator receives a real-time map of elements and can adjust the position of the chip in the horizontal plane. All operations are performed in real time. This approach has been practically tested on industrial equipment developed with the direct participation of the authors.

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Publication Details

Published
2024-10-17
DOI
https://doi.org/10.1117/12.3039006
Primary Topic
Calibration and Measurement Techniques
Type
article
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article

Technical vision system for installation of semiconductor crystals with direct recording of the moment of installation

Andrey Alepko, Evgeny A. Semenishchev, Tagir Abdullin, Ilia Khamidullin et al.
Calibration and Measurement Techniques
article

Technical vision system for installation of semiconductor crystals with direct recording of the moment of installation

Andrey Alepko, Evgeny A. Semenishchev, Tagir Abdullin, Ilia Khamidullin, Prohor Karlov
article en

Abstract

The article discusses the technical vision system of a machine for mounting semiconductor crystals. The disadvantage of existing systems is that the moment of installation of a semiconductor crystal on the substrate is not recorded by a camera and is in no way controlled by the operator. This makes it impossible to manually control such installations and complicates the learning process. <br/> <br/> The authors of the article eliminated this drawback by using two non-orthogonally located cameras, the focuses of which coincide with the location of the crystal on the working tool. The resulting two images are then processed. The contours of the reference marks on the substrate, already installed elements and the mounted crystal are highlighted. After geometric transformations of the selected contours, the operator receives a real-time map of elements and can adjust the position of the chip in the horizontal plane. All operations are performed in real time. This approach has been practically tested on industrial equipment developed with the direct participation of the authors.

Lomonosov Moscow State University (RU), Moscow State Technological University (RU)
Openalex Percentile: Top 71%
Calibration and Measurement Techniques
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