Enhancement of Electrical Properties and Thermal Properties of Polypropylene Composited by Copper Nanowires
Polypropylene materials have attracted much attention due to their wide using temperature zones and are nonpoisonous. However, the poor electrical and thermal properties limit their application. In this work, the Cu nanowires with the single phase structure and uniform microstructure were successfully synthesized by tuning the reaction time. Then, the Cu nanowires were in the polypropylene matrix to optimize the electrical transport properties and thermal transport properties. The results show that the resistance of Cu nanowire-composited samples decreases by orders of magnitude, the resistance for the PP + 0.5 wt% Cu nanowires sample is [Formula: see text], which is two orders of magnitude lower than that of the pristine sample due to the addition carrier transport path. Besides, the thermal diffusion coefficient of the Cu nanowire-composited sample increases to 0.194 mm 2 s[Formula: see text], which is 12.7% higher than that of the pristine sample. The improvement in electrical transport properties and thermal transport properties for polypropylene materials can be applied in the field of package materials, which can reduce energy consumption and the occurrence of safety accidents in the production process.
Authors
- Zhen‐Hua Ge (ORCID: https://orcid.org/0000-0001-8810-5103)
- Xi Yang (ORCID: https://orcid.org/0000-0002-3191-349X)
- Yan An (ORCID: https://orcid.org/0009-0003-5928-6306)
- Xing Wei Yang (ORCID: https://orcid.org/0009-0000-4822-5127)
- Juan Li (ORCID: https://orcid.org/0000-0002-2742-2743)
- Yang Su
- Hui Li (ORCID: https://orcid.org/0000-0002-8639-1203)
- Ran Tian (ORCID: https://orcid.org/0000-0003-2798-9173)
- Jin Wang (ORCID: https://orcid.org/0009-0002-4560-8231)
Institutions
- Kunming University of Science and Technology (CN)
- China Tobacco (CN)
Publication Details
- Journal
- NANO
- Published
- 2024-10-18
- DOI
- https://doi.org/10.1142/s1793292024501704
- Primary Topic
- High voltage insulation and dielectric phenomena
- Type
- article
- Field-Weighted Citation Impact
- 0.00