Ultra-compact on-chip camera based on optoelectronic compound eyes with nonuniform ommatidia

Abstract Compound eyes (CEs) that feature ultra-compact structures and extraordinary versatility have revealed great potential for cutting-edge applications. However, the optoelectronic integration of CEs with available photodetectors is still challenging because the planar charge-coupled device (CCD)/complementary metal oxide semiconductor (CMOS) detector cannot match the spatially distributed images formed by CE ommatidia. To reach this end, we report here the optoelectronic integration of CEs by manufacturing 3D nonuniform ommatidia for developing an ultra-compact on-chip camera. As a proof-of-concept, we fabricated microscale CEs with uniform and nonuniform ommatidia through femtosecond laser two-photon photopolymerization, and compared their focusing/imaging performance both theoretically and experimentally. By engineering the surface profiles of the ommatidia at different positions of the CE, the images formed by all the ommatidia can be tuned on a plane. In this way, the nonuniform CE can be directly integrated with a commercial CMOS photodetector, forming an ultra-compact CE camera. Additionally, we further combine the CE camera with a microfluidic chip, which can further serve as an on-chip microscopic monitoring system. We anticipate that such an ultra-compact CE camera may find broad applications in microfluidics, robotics, and micro-optics.

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Publication Details

Journal
International Journal of Extreme Manufacturing
Published
2024-10-17
DOI
https://doi.org/10.1088/2631-7990/ad8738
Citations
6
Primary Topic
CCD and CMOS Imaging Sensors
Type
article
Field-Weighted Citation Impact
1.25

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article

Ultra-compact on-chip camera based on optoelectronic compound eyes with nonuniform ommatidia

Qi‐Dai Chen, Yong‐Lai Zhang, Zhi‐Juan Sun, Lin Zhu et al.
6 citations
International Journal of Extreme Manufacturing
CCD and CMOS Imaging Sensors
1.25
article

Ultra-compact on-chip camera based on optoelectronic compound eyes with nonuniform ommatidia

Qi‐Dai Chen, Yong‐Lai Zhang, Zhi‐Juan Sun, Lin Zhu, Yuqing Liu, Jiayi Wan, Dongdong Han
article en
6 citations

Abstract

Abstract Compound eyes (CEs) that feature ultra-compact structures and extraordinary versatility have revealed great potential for cutting-edge applications. However, the optoelectronic integration of CEs with available photodetectors is still challenging because the planar charge-coupled device (CCD)/complementary metal oxide semiconductor (CMOS) detector cannot match the spatially distributed images formed by CE ommatidia. To reach this end, we report here the optoelectronic integration of CEs by manufacturing 3D nonuniform ommatidia for developing an ultra-compact on-chip camera. As a proof-of-concept, we fabricated microscale CEs with uniform and nonuniform ommatidia through femtosecond laser two-photon photopolymerization, and compared their focusing/imaging performance both theoretically and experimentally. By engineering the surface profiles of the ommatidia at different positions of the CE, the images formed by all the ommatidia can be tuned on a plane. In this way, the nonuniform CE can be directly integrated with a commercial CMOS photodetector, forming an ultra-compact CE camera. Additionally, we further combine the CE camera with a microfluidic chip, which can further serve as an on-chip microscopic monitoring system. We anticipate that such an ultra-compact CE camera may find broad applications in microfluidics, robotics, and micro-optics.

International Journal of Extreme ManufacturingVol. 7(1)
Northeast Normal University (CN), Jilin University (CN), State Key Laboratory on Integrated Optoelectronics (CN), Zhejiang Lab (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 20%
CCD and CMOS Imaging Sensors
1.25
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