Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid

With the innovation of modern electronics, heat dissipation in the devices faces several problems. In our work, boron nitride (BN) with good thermal conductivity (TC) was successfully fabricated by constructing the BN along the axial direction and the surface-grafted BN hybrid composite fibers via the wet-spinning and hot-pressing method. The unique inter-outer and inter-interconnected hybrid structure of composite fibers exhibited 176.47% thermal conductivity enhancement (TCE), which exhibits good TC, mechanical resistance, and chemical resistance. In addition, depending on the special structure of the composite fibers, it provides a new strategy for fabricating thermal interface materials in the electronic device.

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Publication Details

Journal
International Journal of Molecular Sciences
Published
2024-10-17
DOI
https://doi.org/10.3390/ijms252011156
Citations
7
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
0.82
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article

Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid

Chunhua Zhang, P Zhang, Liangjun Xia, Leyan Zhang et al.
7 citations
International Journal of Molecular Sciences
Thermal properties of materials
0.82
article

Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid

Chunhua Zhang, P Zhang, Liangjun Xia, Leyan Zhang, Jiajing Zhang, Jiahao Xu
article en
7 citations

Abstract

With the innovation of modern electronics, heat dissipation in the devices faces several problems. In our work, boron nitride (BN) with good thermal conductivity (TC) was successfully fabricated by constructing the BN along the axial direction and the surface-grafted BN hybrid composite fibers via the wet-spinning and hot-pressing method. The unique inter-outer and inter-interconnected hybrid structure of composite fibers exhibited 176.47% thermal conductivity enhancement (TCE), which exhibits good TC, mechanical resistance, and chemical resistance. In addition, depending on the special structure of the composite fibers, it provides a new strategy for fabricating thermal interface materials in the electronic device.

International Journal of Molecular SciencesVol. 25(20)
Wuhan Textile University (CN)
Industry, innovation and infrastructure
Openalex Percentile: Top 26%
Thermal properties of materials
0.82
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