Materials, processes, devices and applications of magnetoresistive random access memory

Abstract Magnetoresistive random access memory (MRAM) is a promising non-volatile memory technology that can be utilized as an energy and space-efficient storage and computing solution, particularly in cache functions within circuits. Although MRAM has achieved mass production, its manufacturing process still remains challenging, resulting in only a few semiconductor companies dominating its production. In this review, we delve into the materials, processes, and devices used in MRAM, focusing on both the widely adopted spin transfer torque MRAM and the next-generation spin-orbit torque MRAM. We provide an overview of their operational mechanisms and manufacturing technologies. Furthermore, we outline the major hurdles faced in MRAM manufacturing and propose potential solutions in detail. Then, the applications of MRAM in artificial intelligent hardware are introduced. Finally, we present an outlook on the future development and applications of MRAM.

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Publication Details

Journal
International Journal of Extreme Manufacturing
Published
2024-10-16
DOI
https://doi.org/10.1088/2631-7990/ad87cb
Citations
8
Primary Topic
Advanced Memory and Neural Computing
Type
article
Field-Weighted Citation Impact
1.67
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article

Materials, processes, devices and applications of magnetoresistive random access memory

Meiyin Yang, Jun Luo, Jingsheng Chen, Yan Cui
8 citations
International Journal of Extreme Manufacturing
Advanced Memory and Neural Computing
1.67
article

Materials, processes, devices and applications of magnetoresistive random access memory

Meiyin Yang, Jun Luo, Jingsheng Chen, Yan Cui
article en
8 citations

Abstract

Abstract Magnetoresistive random access memory (MRAM) is a promising non-volatile memory technology that can be utilized as an energy and space-efficient storage and computing solution, particularly in cache functions within circuits. Although MRAM has achieved mass production, its manufacturing process still remains challenging, resulting in only a few semiconductor companies dominating its production. In this review, we delve into the materials, processes, and devices used in MRAM, focusing on both the widely adopted spin transfer torque MRAM and the next-generation spin-orbit torque MRAM. We provide an overview of their operational mechanisms and manufacturing technologies. Furthermore, we outline the major hurdles faced in MRAM manufacturing and propose potential solutions in detail. Then, the applications of MRAM in artificial intelligent hardware are introduced. Finally, we present an outlook on the future development and applications of MRAM.

International Journal of Extreme ManufacturingVol. 7(1)
National University of Singapore (SG), Chinese Academy of Sciences (CN), Institute of Microelectronics (CN), Suzhou Research Institute (CN), University of Chinese Academy of Sciences (CN)
Openalex Percentile: Top 15%
Advanced Memory and Neural Computing
1.67
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Materials, processes, devices and applications of magnetoresistive random access memory — Meiyin Yang, Jun Luo, et al. · International Journal of Extreme Manufacturing (2024) | TGRS Research Map | TGRS