A 100-GHz Power Amplifier With 21%/40.5% 1-/3-dB FBW and 15.1-dBm P<sub>SAT</sub> Using Pole-Tuning Interstage Matching Network in 65-nm CMOS

This letter presents a wideband two-way current-combining power amplifier (PA) for sub-terahertz (sub-THz) wireless communication. The transformer-based fourth-order pole-tuning interstage matching network (IMN) is proposed, analyzed, and adopted to feature flat in-band frequency responses. Fabricated in 65-nm CMOS technology, the PA chip achieves a 1-/3-dB bandwidth of 21.0/40.2 GHz (90.0–111.0/81.1–121.3 GHz) with 21.0%/40.5% 1-/3-dB fractional bandwidth, 15.1-dBm saturated output power, and a peak power-added efficiency (PAE) of 17.1% at 114 GHz. The core chip area of the proposed PA is only 0.12 mm2, leading to a power density of 269.7 mW/mm2.

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Publication Details

Journal
IEEE Microwave and Wireless Technology Letters
Published
2024-10-16
DOI
https://doi.org/10.1109/lmwt.2024.3473932
Citations
2
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
0.42

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article

A 100-GHz Power Amplifier With 21%/40.5% 1-/3-dB FBW and 15.1-dBm PSAT Using Pole-Tuning Interstage Matching Network in 65-nm CMOS

Yiting Zhang, Zhen Yang, Nengxu Zhu, Fanyi Meng
2 citations
IEEE Microwave and Wireless Technology Letters
Radio Frequency Integrated Circuit Design
0.42
article

A 100-GHz Power Amplifier With 21%/40.5% 1-/3-dB FBW and 15.1-dBm PSAT Using Pole-Tuning Interstage Matching Network in 65-nm CMOS

Yiting Zhang, Zhen Yang, Nengxu Zhu, Fanyi Meng
article en
2 citations

Abstract

This letter presents a wideband two-way current-combining power amplifier (PA) for sub-terahertz (sub-THz) wireless communication. The transformer-based fourth-order pole-tuning interstage matching network (IMN) is proposed, analyzed, and adopted to feature flat in-band frequency responses. Fabricated in 65-nm CMOS technology, the PA chip achieves a 1-/3-dB bandwidth of 21.0/40.2 GHz (90.0–111.0/81.1–121.3 GHz) with 21.0%/40.5% 1-/3-dB fractional bandwidth, 15.1-dBm saturated output power, and a peak power-added efficiency (PAE) of 17.1% at 114 GHz. The core chip area of the proposed PA is only 0.12 mm2, leading to a power density of 269.7 mW/mm2.

IEEE Microwave and Wireless Technology LettersVol. 34(12)
Tianjin University (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Affordable and clean energy
Openalex Percentile: Top 37%
Radio Frequency Integrated Circuit Design
0.42
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A 100-GHz Power Amplifier With 21%/40.5% 1-/3-dB FBW and 15.1-dBm P<sub>SAT</sub> Using Pole-Tuning Interstage Matching Network in 65-nm CMOS — Yiting Zhang, Zhen Yang, et al. · IEEE Microwave and Wireless Technology Letters (2024) | TGRS Research Map | TGRS