Comparison of Curing Conditions on Physical Properties, Mechanical Strength Development, and Pore Structures of Phosphogypsum-Based Cold-Bonded Aggregates

This study compared the physical properties and mechanical strength development of PCBAs with water, sealed, standard, and open ambient air curing over 28 days to find a suitable curing method for the production of phosphogypsum-based cold-bonded aggregates. The types and relative amounts of hydration products, microstructural morphology and pore structure parameters were characterized utilizing XRD, TGA, FTIR, SEM and nitrogen adsorption methods. According to the results, water curing leads to rapid increases in single aggregate strength, reaching 5.26 MPa at 7 d. The standard curing condition improved the 28 d mechanical strength of the aggregates by 19.3% over others by promoting the generation of hydration products and the transformation of the C-S-H gel to a higher degree of polymerization and by optimizing the pore structure. Further, PCBAs achieved an excellent solidification of phosphorus impurities under all four curing conditions. This work provides significant guidance for selecting an optimized PCBA curing method for industrial production.