Transmission line with flip-chip structure for high-frequency connection in optoelectronic chips
In this paper, we propose a structure for flip-chip bonding of the transmission line chip, enabling the connection of high-speed optoelectronic chips with other high-speed chips or RF connectors. The simulation results demonstrate that this structure could achieve excellent RF transmission performance and high process tolerance within the range of 10 MHz to 67 GHz.
Authors
- Kunpeng Zhai (ORCID: https://orcid.org/0000-0002-2171-5529)
- Xiaonan Chen
- Keqi Cao
- Yu Liu (ORCID: https://orcid.org/0000-0001-8723-1896)
- Xinyan Zhang (ORCID: https://orcid.org/0009-0006-7805-2048)
- Ming Li (ORCID: https://orcid.org/0000-0003-4882-2743)
- Lin Wei (ORCID: https://orcid.org/0000-0002-5678-3417)
- Jinhua Bai
- Jia Chen (ORCID: https://orcid.org/0009-0003-3041-8555)
- Ninghua Zhu
- Haiqing Yuan
- Hang Yu
Institutions
- Nankai University (CN)
- Institute of Semiconductors (CN)
- University of Chinese Academy of Sciences (CN)
Publication Details
- Published
- 2024-10-11
- DOI
- https://doi.org/10.1117/12.3035011
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00