A Compact V-Band Temperature Compensation Low-Noise Amplifier in a 130 nm SiGe BiCMOS Process

This paper presents a compact V-band low-noise amplifier (LNA) featuring temperature compensation, implemented in a 130 nm SiGe BiCMOS process. A negative temperature coefficient bias circuit generates an adaptive current for temperature compensation, enhancing the LNA's temperature robustness. A T-type inductive network is employed to establish two dominant poles at different frequencies, significantly broadening the amplifier's bandwidth. Over the wide temperature range of -55 °C to 85 °C, the LNA prototype exhibits a gain variation of less than 1.5 dB at test frequencies from 40 GHz to 65 GHz, corresponding to a temperature coefficient of 0.01 dB/°C. At -55 °C, 25 °C, and 85 °C, the measured peak gains are 25.5 dB, 25 dB, and 24.4 dB, respectively, with minimum noise figures (NF) of 3.0 dB, 3.5 dB, and 4.2 dB, and DC power consumptions of 22.3 mW, 27.6 mW, and 34.4 mW. Moreover, the total silicon area of the LNA chip is 0.37 mm<sup>2</sup>, including all test pads, while the core area is only 0.09 mm<sup>2</sup>.

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Publication Details

Journal
Micromachines
Published
2024-10-11
DOI
https://doi.org/10.3390/mi15101248
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
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article

A Compact V-Band Temperature Compensation Low-Noise Amplifier in a 130 nm SiGe BiCMOS Process

Jun Yan Dai, Qiang Cheng, Jiang Luo, Wei Guang Zhao et al.
Micromachines
Radio Frequency Integrated Circuit Design
article

A Compact V-Band Temperature Compensation Low-Noise Amplifier in a 130 nm SiGe BiCMOS Process

Jun Yan Dai, Qiang Cheng, Jiang Luo, Wei Guang Zhao, Yi Shen
article en

Abstract

This paper presents a compact V-band low-noise amplifier (LNA) featuring temperature compensation, implemented in a 130 nm SiGe BiCMOS process. A negative temperature coefficient bias circuit generates an adaptive current for temperature compensation, enhancing the LNA's temperature robustness. A T-type inductive network is employed to establish two dominant poles at different frequencies, significantly broadening the amplifier's bandwidth. Over the wide temperature range of -55 °C to 85 °C, the LNA prototype exhibits a gain variation of less than 1.5 dB at test frequencies from 40 GHz to 65 GHz, corresponding to a temperature coefficient of 0.01 dB/°C. At -55 °C, 25 °C, and 85 °C, the measured peak gains are 25.5 dB, 25 dB, and 24.4 dB, respectively, with minimum noise figures (NF) of 3.0 dB, 3.5 dB, and 4.2 dB, and DC power consumptions of 22.3 mW, 27.6 mW, and 34.4 mW. Moreover, the total silicon area of the LNA chip is 0.37 mm<sup>2</sup>, including all test pads, while the core area is only 0.09 mm<sup>2</sup>.

MicromachinesVol. 15(10)
Hangzhou Dianzi University (CN), Southeast University (CN)
National Natural Science Foundation of China, Southeast University, State Key Laboratory of Millimeter Waves, National Key Research and Development Program of China, Natural Science Foundation of Zhejiang Province
Affordable and clean energy
Openalex Percentile: Top 85%
Radio Frequency Integrated Circuit Design
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A Compact V-Band Temperature Compensation Low-Noise Amplifier in a 130 nm SiGe BiCMOS Process — Jun Yan Dai, Qiang Cheng, et al. · Micromachines (2024) | TGRS Research Map | TGRS