Enhanced Dielectric, Thermal, Energy Storage, Quality Factor, Impedance, and Conductivity Properties of Novel <scp>PVDF</scp>/<scp>PAN</scp>/<scp>ZrO₂</scp> Polymer Nanocomposites for Flexible Electronics Applications

ABSTRACT In this study, novel polymer nanocomposite films based on polyvinylidene fluoride/polyacrylonitrile/zirconium dioxide (PVDF/PAN/ZrO 2 ) were prepared using a solution casting technique. The structural modifications and morphological properties were analyzed by x‐ray diffraction (XRD) and high resolution scanning electron microscopy (HRSEM). The obtained results verified the filler‐polymer interactions and uniform dispersion of the ZrO 2 filler in the host polymers (PVDF and PAN). Thermal stability of up to 46% leftover residue for 30% ZrO 2 nano‐filler loading in the blend polymer nanocomposite was analyzed by thermogravimetric analysis (TGA). The dielectric properties such as dielectric constant and dielectric loss values and impedance, Q ‐factor, and AC conductivity were analyzed using an impedance analyzer. The decrement in impedance with increasing nano‐filler content with improved dielectric, thermal, Q ‐factor, energy density and conductivity properties signifies the prepared novel PVDF/PAN/ZrO 2 polymer nanocomposite as an effective material for flexible electronics applications.