High current density 1.2 kV class HfO<sub>2</sub>-gated vertical GaN trench MOSFETs
Abstract This work reports on high current density 1.2 kV class HfO 2 -gated vertical GaN trench metal-oxide-semiconductor field-effect transistors (MOSFETs). An output current density of 330 mA mm −1 is reported at a drain bias of five volts, which, to our knowledge, is over ten-times the highest reported values for 1.2 kV class GaN or SiC MOSFETs. This work also showcases a significant achievement in demonstrating substantially thick (100 nm) HfO 2 on GaN with simultaneous low leakage current (0.5 nA at 2 MV cm −1 ), a high breakdown strength (5.2 MV cm −1 ), and a high recorded dielectric constant (22.0).
Authors
- Robert Kaplar (ORCID: https://orcid.org/0000-0002-7928-9104)
- Joseph P. Klesko (ORCID: https://orcid.org/0000-0003-3989-8009)
- Peter T. Dickens (ORCID: https://orcid.org/0000-0003-0363-0182)
- Jeffrey Steinfeldt (ORCID: https://orcid.org/0009-0003-8459-9494)
- Andrew Binder (ORCID: https://orcid.org/0000-0002-6649-2816)
- Richard Floyd (ORCID: https://orcid.org/0000-0002-1073-9277)
- Kevin J. Reilly (ORCID: https://orcid.org/0000-0001-7146-3238)
- Andrew A. Allerman
Institutions
- Sandia National Laboratories (US)
Publication Details
- Journal
- Applied Physics Express
- Published
- 2024-10-01
- DOI
- https://doi.org/10.35848/1882-0786/ad85c1
- Citations
- 8
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 2.49