Solution-processable ordered defect compound semiconductors for high-performance electronics
Solution-processable semiconductors hold promise in enabling applications requiring cost-effective electronics at scale but suffer from low performance limited by defects. We show that ordered defect compound semiconductor CuIn<sub>5</sub>Se<sub>8</sub>, which forms regular defect complexes with defect-pair compensation, can simultaneously achieve high performance and solution processability. CuIn<sub>5</sub>Se<sub>8</sub> transistors exhibit defect-tolerant, band-like transport supplying an output current above 35 microamperes per micrometer, with a large on/off ratio greater than 10<sup>6</sup>, a small subthreshold swing of 189 ± 21 millivolts per decade, and a high field-effect mobility of 58 ± 10 square centimeters per volt per second, with excellent uniformity and stability, superior to devices built on its less defective parent compound CuInSe<sub>2</sub>, analogous binary compound In<sub>2</sub>Se<sub>3</sub>, and other solution-deposited semiconductors. They can be monolithically integrated with carbon nanotube transistors to form high-speed and low-voltage three-dimensional complementary logic circuits and with micro-light-emitting diodes to realize high-resolution displays.
Authors
- Fufei An
- Cindy Y. Wong
- H.C. Wang (ORCID: https://orcid.org/0009-0003-7264-186X)
- Kaijun Yin
- André Schleife (ORCID: https://orcid.org/0000-0003-0496-8214)
- Jian‐Min Zuo (ORCID: https://orcid.org/0000-0002-5151-3370)
- Qing Ping Cao (ORCID: https://orcid.org/0000-0002-5844-2376)
- Jiangnan Liu (ORCID: https://orcid.org/0000-0002-1763-7302)
- Yihan Wang
Institutions
- University of Illinois Urbana-Champaign (US)
- National Center for Supercomputing Applications (US)
Publication Details
- Journal
- Science Advances
- Published
- 2024-10-09
- DOI
- https://doi.org/10.1126/sciadv.adr8636
- Citations
- 6
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 1.25
Funders
- National Science Foundation
- University of Illinois at Urbana-Champaign
- Division of Materials Research