Microstructure and properties of C18150 Cu/8011 Al/C18150 Cu laminated composites

In order to solve the problem of insufficient strength and electrical conductivity of Cu-Al composites, C18150 Cu/8011 Al/C18150 Cu composites with a thickness of 1.6 mm were fabricated by cast rolling method in this paper, followed by cold rolling and annealing. The interfacial microstructure and precipitation behavior were analyzed through electron backscatter diffraction, scanning electron microscopy, and transmission electron microscopy in detail. The research results show that the three-layer interfaces from the Al layer to the Cu layer are Al 2 Cu, AlCu, and Al 4 Cu 9 , respectively. The interface of the Al layer and Al 2 Cu layer demonstrate a coherent matching relation, the interface of the Al 2 Cu layer and AlCu layer shows a semi-coherent matching relation, and the interfaces between AlCu and Al 4 Cu 9 , and Al 4 Cu 9 and Cu, are incoherent matching relation. In addition, the Al 2 Fe 3 Si 4 and Cr precipitations were formed in the composites. The composites exhibit extremely outstanding strength- plasticity-conductivity, and the tensile strength and elongation are 295 MPa and 21%, respectively. The electrical conductivity of the Cu and Al layers is 90.6% and 47.6% according to the International Copper Standard, respectively. This study is useful in guiding the further development and application of high-strength and high-conductivity Cu/Al laminated composites.