Strength analysis due to thermal loading and tensile loading when metals are bonded by heat-curing adhesives

• A useful solution of stress intensity factor for edge interface crack in butt joint under mechanical and thermal loading is proposed. • The proposed solution can be used to evaluate the joint strength of butt joints by fictitious crack method. • The approximate formula for calculating the thermal stress intensity factor for metal/resin combinations was presented. • The proposed thermal stress intensity factor solution is useful for predicting the adhesive strength for various bondline thicknesses and temperature changes without numerical calculations. Heat-curing adhesives are widely used after being cured by heating to a temperature higher than room temperature. To evaluate the adhesive strength, therefore, it is necessary to consider both the thermal stress generated during heat curing and external loads such as tensile stress. Butt joint specimens are essential for evaluating tensile adhesive strength but also thermal strength. The interfacial strength can be discussed from the stress intensity factor (SIF) of a fictitious edge interfacial crack assumed at the interface end. This is because the SIF is controlled by the intensity of singular stress field (ISSF) at the crack-free interface end and a constant term associated with the thermal load. In this paper, a useful thermal SIF solution is proposed by superposing the SIF under tensile stress and the SIF under uniform interface stress associated with thermal loading. This general SIF expression provided under arbitrary material combination can be applied for predicting the tensile strength σ c and critical temperature change Δ T without performing new FEM calculations. The usefulness of the expression is confirmed through the adhesive strength of Aluminum/Epoxy butt joint experimentally obtained. Once the critical SIF K 1 C can be obtained from the tensile strength σ c and the temperature change Δ T , the adhesive strength can be expressed as K 1 C = constant of an assumed fictitious interface, and this can be used to predict critical σ c for various temperature change Δ T and for various adhesive bondline thickness h .