Impact of magnetic field variation on thermally annealed tantalum-filled vertical superconducting interconnects for scalable quantum computing systems

Efforts to scale down advanced quantum processors with more numbers of qubits offer challenges since the integration of qubits is a significant obstacle in the path. Superconducting vertical interconnects in 3D IC integration can provide a crucial solution for wiring complexities, as shorter interconnections reduce energy loss when working in cryogenic conditions with better signal fidelity. Using the time-dependent Ginzburg–Landau equation, this simulation study analyzes vertical superconducting interconnects filled with materials like tantalum, niobium, and thermally annealed tantalum. It also investigates how London penetration depth (temperature-dependent) and magnetic fields affect Cooper pair density and, consequently, current density.