Effects of rotation speed on the grinding process during high-speed diamond drilling by considering the metal matrix/rock chips interface

In this paper, the effect of rotation speed on the grinding process during the high-speed diamond drilling was studied by considering the metal matrix/rock chips interface. The results showed that when the grinding enters the Phase 3 (three-body wear among diamond, matrix, and rock cuttings), the weight-on-bit and frictional force exhibited significant periodicity. The two-body grinding process (Phase 1 and 2) was converted into a three-body grinding process (Phase 3). The results of the microscopic showed that the depth of each revolution became shallower, and the increasing proportion of primary chip was higher than that of the secondary chip as the speed increased at Phase 3. The increasing the rotational speed promotes the generation of primary chips and inhibits brittle fracture.