Self-sufficient ESD Solution for Fail-safe I/O Design in FinFET Technology
A silicon validated novel snapback ESD design to provide self-sufficient ESD protection for fail-safe I/O in FinFET technology is introduced. The self-sufficient ESD provides I/O to ground, I/O to power and power to ground discharge paths in single ESD cell to efficiently suppress ESD clamping voltage in all ESD zapping combinations. Low-ESD clamping voltage benefit of self-sufficient snapback ESD can relax fail-safe I/O victim design requirement to size-down fail-safe I/O and reduce power clamp requirement in I/O clusters to reduce I/O standby leakage.
Authors
- Kuo-Ji Chen
- Ming-Hsiang Song
- Hsin-Yu Chen (ORCID: https://orcid.org/0000-0001-6268-5023)
- Tzu-Heng Chang (ORCID: https://orcid.org/0000-0002-6778-6517)
Institutions
- Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Publication Details
- Published
- 2024-09-16
- DOI
- https://doi.org/10.23919/eos/esd61719.2024.10702153
- Citations
- 2
- Primary Topic
- Electrostatic Discharge in Electronics
- Type
- article
- Field-Weighted Citation Impact
- 0.42