Self-sufficient ESD Solution for Fail-safe I/O Design in FinFET Technology

A silicon validated novel snapback ESD design to provide self-sufficient ESD protection for fail-safe I/O in FinFET technology is introduced. The self-sufficient ESD provides I/O to ground, I/O to power and power to ground discharge paths in single ESD cell to efficiently suppress ESD clamping voltage in all ESD zapping combinations. Low-ESD clamping voltage benefit of self-sufficient snapback ESD can relax fail-safe I/O victim design requirement to size-down fail-safe I/O and reduce power clamp requirement in I/O clusters to reduce I/O standby leakage.

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Publication Details

Published
2024-09-16
DOI
https://doi.org/10.23919/eos/esd61719.2024.10702153
Citations
2
Primary Topic
Electrostatic Discharge in Electronics
Type
article
Field-Weighted Citation Impact
0.42
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article

Self-sufficient ESD Solution for Fail-safe I/O Design in FinFET Technology

Kuo-Ji Chen, Ming-Hsiang Song, Hsin-Yu Chen, Tzu-Heng Chang
2 citations
Electrostatic Discharge in Electronics
0.42
article

Self-sufficient ESD Solution for Fail-safe I/O Design in FinFET Technology

Kuo-Ji Chen, Ming-Hsiang Song, Hsin-Yu Chen, Tzu-Heng Chang
article en
2 citations

Abstract

A silicon validated novel snapback ESD design to provide self-sufficient ESD protection for fail-safe I/O in FinFET technology is introduced. The self-sufficient ESD provides I/O to ground, I/O to power and power to ground discharge paths in single ESD cell to efficiently suppress ESD clamping voltage in all ESD zapping combinations. Low-ESD clamping voltage benefit of self-sufficient snapback ESD can relax fail-safe I/O victim design requirement to size-down fail-safe I/O and reduce power clamp requirement in I/O clusters to reduce I/O standby leakage.

Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Openalex Percentile: Top 37%
Electrostatic Discharge in Electronics
0.42
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