Secondary Discharges during FICDM Stress – Source & Solution

Sometimes during CDM testing, we see that the discharge current polarity is opposite to that of the stress condition. Its occurrence is random and is seen only when Single Discharge mode is used. This paper explores the root-cause of this random event and provides a solution on how to eradicate it.

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Publication Details

Published
2024-09-16
DOI
https://doi.org/10.23919/eos/esd61719.2024.10702121
Primary Topic
Electrostatic Discharge in Electronics
Type
article
Field-Weighted Citation Impact
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article

Secondary Discharges during FICDM Stress – Source & Solution

Tom Meuse, S. Bychikhin, Sander Sluiter, Sheela Verwoerd
Electrostatic Discharge in Electronics
article

Secondary Discharges during FICDM Stress – Source & Solution

Tom Meuse, S. Bychikhin, Sander Sluiter, Sheela Verwoerd
article en

Abstract

Sometimes during CDM testing, we see that the discharge current polarity is opposite to that of the stress condition. Its occurrence is random and is seen only when Single Discharge mode is used. This paper explores the root-cause of this random event and provides a solution on how to eradicate it.

NXP (Netherlands) (NL), Thermo Fisher Scientific (United States) (US)
Openalex Percentile: Top 85%
Electrostatic Discharge in Electronics
DOISourceOpenAlex
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Secondary Discharges during FICDM Stress – Source & Solution — Tom Meuse, S. Bychikhin, et al. · (2024) | TGRS Research Map | TGRS